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Single-chip DIMM stacks integrated circuits like shingles for greater DRAM efficiency

Thursday, September 8, 2011


Cellphone screens may be getting bigger, but the push to shrink all other computing components continues unabated. Invensas is well aware of this, and has come up with new, multi-die memory that promises to be both smaller in size and more capacious than existing DRAM. Called xFD, it mounts integrated circuits in a "shingle-like configuration" on top of one another to accomplish the trick. Such stacking increases speed while reducing power consumption due to much shorter connections between RAM dies than what's found in multi-chip DIMM. Of course, the memory won't be popping up in PCs anytime soon, but the company will be showing off its new tech at IDF next week. While you wait, there's more RAM reading in the PR after the break.

Tags: dimm, dram, efficiency, idf, idf 2011, Idf2011, intel developers conference, IntelDevelopersConference, invensas, memory, ram, Tessera, Tessera Technologies, TesseraTechnologies.


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